3M Cubitron II Depressed Center Grinding Wheel

The 3M Cubitron II Depressed Center Grinding Wheel is a rigid resin‑bonded wheel engineered with precision‑shaped ceramic grain for fast, cool cutting and long life in heavy weld removal and grinding applications.

Key Features

• Precision‑shaped ceramic grain provides faster cut rates and cooler operation.
• Rigid resin bond gives a 1/4" (6 mm) thick wheel ideal for heavy-duty grinding.
• Designed for robotic and pressure‑assisted weld grinding to reduce downtime.
• Depressed center (Type 27) allows grinding at any angle without damaging surrounding material.

Specifications

• Overall Diameter: 4.5 in, 9 in (115 mm, 230 mm)
• Overall Thickness: 0.25 in (6 mm)
• Center Hole Diameter: 0.875 in (22.23 mm)
• Center Hole Thread: 5/8"‑11
• Grit: 36+
• Abrasive Material: Precision Shaped Ceramic
• Bond Type: Resin
• Maximum Surface Speed: 80 m/s

Applications

• Weld grinding and removal
• Edge chamfering and beveling
• Plate and right‑angle grinding
• Gate removal in casting
• General metalworking on stainless steel, mild steel, and aerospace alloys